Christine Harendt

32 papers and 349 indexed citations i.

Christine Harendt has authored 32 papers that have received a total of 349 indexed citations. This includes 30 papers in Electrical and Electronic Engineering, 15 papers in Biomedical Engineering and 3 papers in Bioengineering. The topics of these papers are 3D IC and TSV technologies (17 papers), Advanced MEMS and NEMS Technologies (11 papers) and Electronic Packaging and Soldering Technologies (7 papers). Christine Harendt is often cited by papers focused on 3D IC and TSV technologies (17 papers), Advanced MEMS and NEMS Technologies (11 papers) and Electronic Packaging and Soldering Technologies (7 papers) and collaborates with scholars based in Germany, United States and Italy. Christine Harendt's co-authors include Joachim N. Burghartz, B. Höfflinger, Heinz‐Gerd Graf, Horst Rempp and H. Richter and has published in prestigious journals such as Journal of The Electrochemical Society, ACS Applied Materials & Interfaces and Sensors