Chuantong Chen
About
Chuantong Chen has authored 146 papers that have received a total of 2.2k indexed citations.
This includes 113 papers in Electrical and Electronic Engineering, 86 papers in Mechanical Engineering and 25 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (102 papers), Aluminum Alloys Composites Properties (55 papers) and 3D IC and TSV technologies (48 papers). Chuantong Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (102 papers), Aluminum Alloys Composites Properties (55 papers) and 3D IC and TSV technologies (48 papers) and collaborates with scholars based in Japan, China and South Korea. Chuantong Chen's co-authors include Katsuaki Suganuma, Shijo Nagao, Dongjin Kim, Chanyang Choe and Tohru Sugahara and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Acta Materialia
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