Chukwudi Okoro
About
Chukwudi Okoro has authored 36 papers that have received a total of 530 indexed citations.
This includes 35 papers in Electrical and Electronic Engineering, 15 papers in Electronic, Optical and Magnetic Materials and 6 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (27 papers) and Copper Interconnects and Reliability (15 papers). Chukwudi Okoro is often cited by papers focused on 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (27 papers) and Copper Interconnects and Reliability (15 papers) and collaborates with scholars based in United States, Belgium and Egypt. Chukwudi Okoro's co-authors include Yaw S. Obeng, Lyle E. Levine, Eric Beyne, Bart Vandevelde and Ruqing Xu and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of Materials Science
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