Chulmin Oh

39 papers and 360 indexed citations i.

Chulmin Oh has authored 39 papers that have received a total of 360 indexed citations. This includes 31 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (17 papers) and Copper Interconnects and Reliability (6 papers). Chulmin Oh is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (17 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in South Korea, Japan and Taiwan. Chulmin Oh's co-authors include Katsuaki Suganuma, Shijo Nagao, Changwoon Han, Mi Song Kim and Dajung Kim and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Solar Energy Materials and Solar Cells