C.‐K. Hu
About
C.‐K. Hu has authored 43 papers that have received a total of 2.0k indexed citations.
This includes 35 papers in Electrical and Electronic Engineering, 32 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (16 papers). C.‐K. Hu is often cited by papers focused on Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (16 papers) and collaborates with scholars based in United States and Italy. C.‐K. Hu's co-authors include R. Rosenberg, E. Liniger, Lynne Gignac, L. Gignac and I. C. Noyan and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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