C.K. Wong
About
C.K. Wong has authored 16 papers that have received a total of 290 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 3 papers in Computational Mechanics. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). C.K. Wong is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers) and collaborates with scholars based in Singapore, Japan and Hong Kong. C.K. Wong's co-authors include Jun Wei, Mui Ling Sharon Nai, Ryutaro Maeda, L.C. Lee and B. K. Lok and has published in prestigious journals such as Chemosphere, IEEE Transactions on Power Systems and Thin Solid Films
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