C.P. Wong
About
C.P. Wong has authored 353 papers that have received a total of 17.5k indexed citations.
This includes 204 papers in Electrical and Electronic Engineering, 118 papers in Biomedical Engineering and 101 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (123 papers), 3D IC and TSV technologies (76 papers) and Advanced Sensor and Energy Harvesting Materials (76 papers). C.P. Wong is often cited by papers focused on Electronic Packaging and Soldering Technologies (123 papers), 3D IC and TSV technologies (76 papers) and Advanced Sensor and Energy Harvesting Materials (76 papers) and collaborates with scholars based in United States, China and Hong Kong. C.P. Wong's co-authors include Kyoung‐sik Moon, Wei Lin, Ziyin Lin, Yonghao Xiu and Hongjin Jiang and has published in prestigious journals such as Science, Journal of the American Chemical Society and Advanced Materials
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