Craig Hillman
About
Craig Hillman has authored 20 papers that have received a total of 490 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). Craig Hillman is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers) and collaborates with scholars based in United States, South Korea and Germany. Craig Hillman's co-authors include Michael Pecht, Keith L. Rogers, Steven R. Murray, Zhigang Suo and Lloyd W. Condra and has published in prestigious journals such as Journal of the American Ceramic Society, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Prasad P. Devarshi are about Top authors papers by Glen Wright are co-authored with Top journals papers by Adrian L. Kerrihard are published in Top authors papers by Chad K Rostron are co-authored with Top authors papers by Nellie Wadonda-Kabondo are co-authored with Top journals papers by Dexuan Ma are published in Top countries impacted by papers by Muhammad B.I. Chowdhury Top authors papers by Lichun Zhou are co-authored with