Cui Huang

24 papers and 437 indexed citations i.

Cui Huang has authored 24 papers that have received a total of 437 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (13 papers), Semiconductor materials and devices (11 papers) and Electronic Packaging and Soldering Technologies (8 papers). Cui Huang is often cited by papers focused on 3D IC and TSV technologies (13 papers), Semiconductor materials and devices (11 papers) and Electronic Packaging and Soldering Technologies (8 papers) and collaborates with scholars based in China. Cui Huang's co-authors include Zheyao Wang, Junbo Gong, Shichao Du, Yujia Qin and Qianwen Chen and has published in prestigious journals such as Journal of Hazardous Materials, Industrial & Engineering Chemistry Research and IEEE Transactions on Electron Devices