C.W. Surovic

20 papers and 612 indexed citations i.

C.W. Surovic has authored 20 papers that have received a total of 612 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 2 papers in Hardware and Architecture. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (15 papers), 3D IC and TSV technologies (14 papers) and Electronic Packaging and Soldering Technologies (6 papers). C.W. Surovic is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (15 papers), 3D IC and TSV technologies (14 papers) and Electronic Packaging and Soldering Technologies (6 papers) and collaborates with scholars based in United States and Germany. C.W. Surovic's co-authors include A. Deutsch, G.V. Kopcsay, P. Coteus, G. Katopis and B.J. Rubin and has published in prestigious journals such as Proceedings of the IEEE, IEEE Transactions on Microwave Theory and Techniques and IBM Journal of Research and Development