D. Bouchu

15 papers and 106 indexed citations i.

D. Bouchu has authored 15 papers that have received a total of 106 indexed citations. This includes 14 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 1 paper in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (11 papers), Copper Interconnects and Reliability (10 papers) and Electronic Packaging and Soldering Technologies (8 papers). D. Bouchu is often cited by papers focused on 3D IC and TSV technologies (11 papers), Copper Interconnects and Reliability (10 papers) and Electronic Packaging and Soldering Technologies (8 papers) and collaborates with scholars based in France, Belgium and Switzerland. D. Bouchu's co-authors include S. Moreau, A. Farcy, Pierre Montmitonnet, S. Lhostis and G. Passemard and has published in prestigious journals such as IEEE Electron Device Letters, Microelectronic Engineering and Microelectronics Reliability