D. Edelstein
About
D. Edelstein has authored 52 papers that have received a total of 1.2k indexed citations.
This includes 47 papers in Electrical and Electronic Engineering, 35 papers in Electronic, Optical and Magnetic Materials and 5 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (35 papers), Semiconductor materials and devices (28 papers) and Electronic Packaging and Soldering Technologies (17 papers). D. Edelstein is often cited by papers focused on Copper Interconnects and Reliability (35 papers), Semiconductor materials and devices (28 papers) and Electronic Packaging and Soldering Technologies (17 papers) and collaborates with scholars based in United States, Israel and Germany. D. Edelstein's co-authors include C.-C. Yang, R. Rosenberg, T. Nogami, Nicholas A. Lanzillo and Aharon M. Eyal and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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