D. F. Lim
About
D. F. Lim has authored 19 papers that have received a total of 369 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 8 papers in Automotive Engineering and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (14 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). D. F. Lim is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (14 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers) and collaborates with scholars based in Singapore, China and United States. D. F. Lim's co-authors include Chuan Seng Tan, Lan Peng, Ji Fan, Kam W. Leong and Hong Yu Li and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices
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