D. J. Yao

13 papers and 331 indexed citations i.

D. J. Yao has authored 13 papers that have received a total of 331 indexed citations. This includes 11 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (3 papers). D. J. Yao is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (3 papers) and collaborates with scholars based in Taiwan, United States and China. D. J. Yao's co-authors include Chih Chen, Chia‐Min Yang, T. L. Shao, Kea‐Tiong Tang and Chang‐Hsiao Chen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Langmuir