D. Restaino

9 papers and 136 indexed citations i.

D. Restaino has authored 9 papers that have received a total of 136 indexed citations. This includes 8 papers in Electronic, Optical and Magnetic Materials, 6 papers in Electrical and Electronic Engineering and 2 papers in Biomedical Engineering. The topics of these papers are Copper Interconnects and Reliability (8 papers), Electronic Packaging and Soldering Technologies (4 papers) and Electrodeposition and Electroless Coatings (2 papers). D. Restaino is often cited by papers focused on Copper Interconnects and Reliability (8 papers), Electronic Packaging and Soldering Technologies (4 papers) and Electrodeposition and Electroless Coatings (2 papers) and collaborates with scholars based in United States and Germany. D. Restaino's co-authors include R. Rosenberg, Soon‐Cheon Seo, Sharon L. Smith, J. Germán Rubino and D. Canaperi and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society