D. Temple
About
D. Temple has authored 92 papers that have received a total of 1.4k indexed citations.
This includes 71 papers in Electrical and Electronic Engineering, 23 papers in Materials Chemistry and 19 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (23 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (15 papers). D. Temple is often cited by papers focused on 3D IC and TSV technologies (23 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (15 papers) and collaborates with scholars based in United States, India and Germany. D. Temple's co-authors include Jay Lewis, Arnold Reisman, William D. Palmer, G. E. McGuire and Matthew Lueck and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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