Dan Simon
About
Dan Simon has authored 4 papers that have received a total of 68 indexed citations.
This includes 4 papers in Electrical and Electronic Engineering, 1 paper in Materials Chemistry and 1 paper in Automotive Engineering. The topics of these papers are Silicon Carbide Semiconductor Technologies (4 papers), Electronic Packaging and Soldering Technologies (2 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers). Dan Simon is often cited by papers focused on Silicon Carbide Semiconductor Technologies (4 papers), Electronic Packaging and Soldering Technologies (2 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers) and collaborates with scholars based in Romania, Germany and Belgium. Dan Simon's co-authors include Vasile Țopa, Gilbert De Mey and Martin Pfost and has published in prestigious journals such as IEEE Electron Device Letters, IEEE Transactions on Semiconductor Manufacturing and IEEE Transactions on Device and Materials Reliability
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