Daniel Scevola

3 papers and 42 indexed citations i.

Daniel Scevola has authored 3 papers that have received a total of 42 indexed citations. This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Automotive Engineering and 1 paper in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers). Daniel Scevola is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers) and collaborates with scholars based in France, Czechia and The Netherlands. Daniel Scevola's co-authors include L. Di Cioccio, P. Gergaud, Marc Zussy, D. Lafond and M. Rivoire and has published in prestigious journals such as Journal of The Electrochemical Society and ECS Transactions