Daniel Schwab

12 papers and 185 indexed citations i.

Daniel Schwab has authored 12 papers that have received a total of 185 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Hardware and Architecture. The topics of these papers are 3D IC and TSV technologies (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). Daniel Schwab is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers) and collaborates with scholars based in United States, Canada and Germany. Daniel Schwab's co-authors include Barry K. Gilbert, Erik S. Daniel, B.A. Randall, Michael F. Zaeh and Guang-Tsai Lei and has published in prestigious journals such as Proceedings of the IEEE, IEEE Journal of Solid-State Circuits and IEEE Transactions on Instrumentation and Measurement