Daoguo Yang

94 papers and 2.4k indexed citations i.

Daoguo Yang has authored 94 papers that have received a total of 2.4k indexed citations. This includes 56 papers in Electrical and Electronic Engineering, 27 papers in Materials Chemistry and 20 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (26 papers), GaN-based semiconductor devices and materials (14 papers) and 3D IC and TSV technologies (14 papers). Daoguo Yang is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), GaN-based semiconductor devices and materials (14 papers) and 3D IC and TSV technologies (14 papers) and collaborates with scholars based in China, The Netherlands and United States. Daoguo Yang's co-authors include Xianping Chen, Guoqi Zhang, Miao Cai, Ping Zhang and Xuejun Fan and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Chemical Physics Letters