Daquan Yu

89 papers and 1.7k indexed citations i.

Daquan Yu has authored 89 papers that have received a total of 1.7k indexed citations. This includes 84 papers in Electrical and Electronic Engineering, 21 papers in Mechanical Engineering and 19 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (59 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Daquan Yu is often cited by papers focused on Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (59 papers) and Intermetallics and Advanced Alloy Properties (10 papers) and collaborates with scholars based in China, Hong Kong and Singapore. Daquan Yu's co-authors include Chi‐Man Lawrence Wu, C. Law, Chengkuo Lee and Ning Zhao and has published in prestigious journals such as Applied Physics Letters, Applied Surface Science and Sensors