Darvin Edwards
About
Darvin Edwards has authored 16 papers that have received a total of 567 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). Darvin Edwards is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers) and collaborates with scholars based in United States and Taiwan. Darvin Edwards's co-authors include Jie-Hua Zhao, R.J. Stierman, Vikas Gupta, Tz-Cheng Chiu and Paul S. Ho and has published in prestigious journals such as Journal of Applied Physics, Journal of Materials Science and Journal of Electronic Materials
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Bachar Cheaib are published in Top journals papers by Janine Street are published in Top fields papers by M Eckert are about Top authors papers by Chris Kirtley are co-authored with Top journals papers by Stephen L. Underwood are published in Top countries impacted by papers by Gail J. Pyne Top countries impacted by papers by Moshe Isserles Top countries impacted by papers by Kasandra Riley