David Ho

16 papers and 99 indexed citations i.

David Ho has authored 16 papers that have received a total of 99 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 2 papers in Hardware and Architecture. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Silicon Carbide Semiconductor Technologies (3 papers). David Ho is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Silicon Carbide Semiconductor Technologies (3 papers) and collaborates with scholars based in Singapore, United States and Taiwan. David Ho's co-authors include Zhaohui Chen, Fa Xing, Batara Surya, J. Langer and Xiaowu Zhang and has published in prestigious journals such as Materials, Applied Physics Reviews and IEEE Transactions on Components Packaging and Manufacturing Technology