D.C. Lin

13 papers and 433 indexed citations i.

D.C. Lin has authored 13 papers that have received a total of 433 indexed citations. This includes 12 papers in Mechanical Engineering, 7 papers in Electrical and Electronic Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Aluminum Alloys Composites Properties (5 papers). D.C. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Aluminum Alloys Composites Properties (5 papers) and collaborates with scholars based in United States and Australia. D.C. Lin's co-authors include Radovan Kovacevic, T. S. Srivatsan, T. S. Srivatsan, M. Petraroli and G.-X. Wang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Processing Technology and Powder Technology