Ding-Ming Kwai
About
Ding-Ming Kwai has authored 42 papers that have received a total of 306 indexed citations.
This includes 30 papers in Electrical and Electronic Engineering, 21 papers in Hardware and Architecture and 13 papers in Computer Networks and Communications. The topics of these papers are VLSI and Analog Circuit Testing (15 papers), 3D IC and TSV technologies (14 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). Ding-Ming Kwai is often cited by papers focused on VLSI and Analog Circuit Testing (15 papers), 3D IC and TSV technologies (14 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers) and collaborates with scholars based in Taiwan and United States. Ding-Ming Kwai's co-authors include Yung-Fa Chou, Cheng‐Wen Wu, Kwang‐Ting Cheng, Behrooz Parhami and Jiun-Lang Huang and has published in prestigious journals such as IEEE Transactions on Computers, IEEE Transactions on Parallel and Distributed Systems and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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