Dinh-Phuc Tran

62 papers and 478 indexed citations i.

Dinh-Phuc Tran has authored 62 papers that have received a total of 478 indexed citations. This includes 49 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 18 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (20 papers) and Copper Interconnects and Reliability (17 papers). Dinh-Phuc Tran is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (20 papers) and Copper Interconnects and Reliability (17 papers) and collaborates with scholars based in Taiwan, The Netherlands and Hong Kong. Dinh-Phuc Tran's co-authors include Chih Chen, K. N. Tu, Shih‐Chi Yang, Ioan E. Lager and L.P. Ligthart and has published in prestigious journals such as Journal of The Electrochemical Society, Scientific Reports and Electrochimica Acta