Do-Hyoung Kim
About
Do-Hyoung Kim has authored 11 papers that have received a total of 387 indexed citations.
This includes 9 papers in Mechanics of Materials, 5 papers in Civil and Structural Engineering and 4 papers in Electrical and Electronic Engineering. The topics of these papers are Mechanical Behavior of Composites (6 papers), Structural Response to Dynamic Loads (3 papers) and Electronic Packaging and Soldering Technologies (2 papers). Do-Hyoung Kim is often cited by papers focused on Mechanical Behavior of Composites (6 papers), Structural Response to Dynamic Loads (3 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in South Korea. Do-Hyoung Kim's co-authors include Hak‐Sung Kim, Hak-Sung Kim, Hee-June Kim, Sung-Jun Joo and Sung-Hyeon Park and has published in prestigious journals such as Composites Part B Engineering, Composite Structures and Journal of Micromechanics and Microengineering
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