Dong Hu

35 papers and 363 indexed citations i.

Dong Hu has authored 35 papers that have received a total of 363 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (7 papers) and 3D IC and TSV technologies (4 papers). Dong Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (7 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in China, The Netherlands and United States. Dong Hu's co-authors include Guoqi Zhang, Jiajie Fan, Xuejun Fan, Sten Vollebregt and Zhen Cui and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry C and Materials Science and Engineering A