Dong Hu
About
Dong Hu has authored 35 papers that have received a total of 363 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (7 papers) and 3D IC and TSV technologies (4 papers). Dong Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (7 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in China, The Netherlands and United States. Dong Hu's co-authors include Guoqi Zhang, Jiajie Fan, Xuejun Fan, Sten Vollebregt and Zhen Cui and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry C and Materials Science and Engineering A
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Muhammad Waqas Anwar Top authors papers by Poulomi De are co-authored with Top countries impacted by papers by Jiayu Ling Top authors papers by Mustafa Yıldız are co-authored with Top fields papers by Yasuko Sasaki are about Top countries impacted by papers by Muhammad Inam Afzal Top countries impacted by papers by Jian You Top fields papers by R. L. McNeely are about