Dong Kil Shin
About
Dong Kil Shin has authored 21 papers that have received a total of 309 indexed citations.
This includes 12 papers in Mechanics of Materials, 8 papers in Materials Chemistry and 4 papers in Civil and Structural Engineering. The topics of these papers are Mechanical Behavior of Composites (5 papers), Metal and Thin Film Mechanics (4 papers) and Electronic Packaging and Soldering Technologies (3 papers). Dong Kil Shin is often cited by papers focused on Mechanical Behavior of Composites (5 papers), Metal and Thin Film Mechanics (4 papers) and Electronic Packaging and Soldering Technologies (3 papers) and collaborates with scholars based in South Korea, India and United States. Dong Kil Shin's co-authors include Jung Ju Lee, Jay Im, Annu Annu, Shin Kim and Nagender Singh and has published in prestigious journals such as Thin Solid Films, RSC Advances and International Journal of Solids and Structures
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