E. Sprogis
About
E. Sprogis has authored 13 papers that have received a total of 810 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 2 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (11 papers), Semiconductor materials and devices (9 papers) and Electronic Packaging and Soldering Technologies (7 papers). E. Sprogis is often cited by papers focused on 3D IC and TSV technologies (11 papers), Semiconductor materials and devices (9 papers) and Electronic Packaging and Soldering Technologies (7 papers) and collaborates with scholars based in United States and Japan. E. Sprogis's co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, John Knickerbocker and Bucknell C. Webb and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Electron Device Letters and IBM Journal of Research and Development
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