E. Todd Ryan
About
E. Todd Ryan has authored 53 papers that have received a total of 1.4k indexed citations.
This includes 39 papers in Electrical and Electronic Engineering, 37 papers in Electronic, Optical and Magnetic Materials and 22 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (37 papers), Semiconductor materials and devices (31 papers) and Metal and Thin Film Mechanics (14 papers). E. Todd Ryan is often cited by papers focused on Copper Interconnects and Reliability (37 papers), Semiconductor materials and devices (31 papers) and Metal and Thin Film Mechanics (14 papers) and collaborates with scholars based in United States, Canada and China. E. Todd Ryan's co-authors include David W. Gidley, Eric Weitz, Jeremy Martin, J. L. Shohet and Paul S. Ho and has published in prestigious journals such as Angewandte Chemie International Edition, The Journal of Chemical Physics and Applied Physics Letters
In The Last Decade
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