E.B. Liao

18 papers and 206 indexed citations i.

E.B. Liao has authored 18 papers that have received a total of 206 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 2 papers in Materials Chemistry and 2 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and devices (6 papers). E.B. Liao is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and devices (6 papers) and collaborates with scholars based in Singapore, United States and China. E.B. Liao's co-authors include Rakesh Kumar, N. Balasubramanian, Guo Li, R. Nagarajan and G. Q. Lo and has published in prestigious journals such as Chemical Engineering Journal, Thin Solid Films and IEEE Transactions on Electron Devices