Edward O. Shaffer
About
Edward O. Shaffer has authored 20 papers that have received a total of 497 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 9 papers in Mechanics of Materials and 8 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (8 papers) and Mechanical Behavior of Composites (4 papers). Edward O. Shaffer is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (8 papers) and Mechanical Behavior of Composites (4 papers) and collaborates with scholars based in United States, India and United Kingdom. Edward O. Shaffer's co-authors include F. J. McGarry, Robert Geer, P. H. Townsend, M. E. Mills and Alain E. Kaloyeros and has published in prestigious journals such as Physical Review Letters, Advanced Materials and Macromolecules
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Eduardo H. Sánchez-Mendoza are about Top countries impacted by papers by Jesús H. Rodríguez Top countries impacted by papers by Arnold K. Gash Top fields papers by Brenda Koniar are about Top journals papers by G. Kaplanski are published in Top journals papers by J. B. Eastwood are published in Top fields papers by Xiangqing Wang are about Top countries impacted by papers by Francis B. Gordon