E.H. Wong

92 papers and 1.9k indexed citations i.

E.H. Wong has authored 92 papers that have received a total of 1.9k indexed citations. This includes 57 papers in Electrical and Electronic Engineering, 38 papers in Mechanics of Materials and 23 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (23 papers) and Mechanical Behavior of Composites (19 papers). E.H. Wong is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (23 papers) and Mechanical Behavior of Composites (19 papers) and collaborates with scholars based in Singapore, United States and Australia. E.H. Wong's co-authors include Subodh G. Mhaisalkar, S.K.W. Seah, R. Rajoo, W.D. van Driel and Yiu‐Wing Mai and has published in prestigious journals such as Nano Letters, Journal of Applied Physics and Coordination Chemistry Reviews