Ennis T. Ogawa

18 papers and 255 indexed citations i.

Ennis T. Ogawa has authored 18 papers that have received a total of 255 indexed citations. This includes 12 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (10 papers), Semiconductor materials and devices (10 papers) and Electronic Packaging and Soldering Technologies (5 papers). Ennis T. Ogawa is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Semiconductor materials and devices (10 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States. Ennis T. Ogawa's co-authors include Paul S. Ho, V. Blaschke, Patrick Justison, Xia Lu and Robert Havemann and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Magnetics