Ephrem Wu
About
Ephrem Wu has authored 6 papers that have received a total of 121 indexed citations.
This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Hardware and Architecture and 1 paper in Plant Science. The topics of these papers are Electronic Packaging and Soldering Technologies (2 papers), Photonic and Optical Devices (1 paper) and Topic Modeling (1 paper). Ephrem Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (2 papers), Photonic and Optical Devices (1 paper) and Topic Modeling (1 paper) and collaborates with scholars based in United States. Ephrem Wu's co-authors include Suresh Ramalingam, Wu-Tung Cheng, Bahareh Banijamali, Liam Madden and Janusz Lewandowski and has published in prestigious journals such as Proceedings of the National Academy of Sciences, IEEE Communications Magazine and IEEE Transactions on Robotics and Automation
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