E.T. Ogawa

4 papers and 176 indexed citations i.

E.T. Ogawa has authored 4 papers that have received a total of 176 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), Copper Interconnects and Reliability (4 papers) and Semiconductor materials and devices (3 papers). E.T. Ogawa is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), Copper Interconnects and Reliability (4 papers) and Semiconductor materials and devices (3 papers) and collaborates with scholars based in United States. E.T. Ogawa's co-authors include V. Blaschke, Paul S. Ho, Hongjian Guo, Patrick Justison and Ki-Don Lee and has published in prestigious journals such as Applied Physics Letters, Journal of materials research/Pratt's guide to venture capital sources and IEEE Transactions on Reliability