Evgeny E. Glickman

40 papers and 475 indexed citations i.

Evgeny E. Glickman has authored 40 papers that have received a total of 475 indexed citations. This includes 30 papers in Electronic, Optical and Magnetic Materials, 24 papers in Electrical and Electronic Engineering and 14 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (30 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (11 papers). Evgeny E. Glickman is often cited by papers focused on Copper Interconnects and Reliability (30 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (11 papers) and collaborates with scholars based in Israel, United States and Russia. Evgeny E. Glickman's co-authors include Alexandra Inberg, M. Nathan, Yosi Shacham‐Diamand, N. Croitoru and Leonid Klinger and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia