F. de Crécy
About
F. de Crécy has authored 23 papers that have received a total of 360 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Heat Transfer and Boiling Studies (4 papers). F. de Crécy is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Heat Transfer and Boiling Studies (4 papers) and collaborates with scholars based in France, Switzerland and Spain. F. de Crécy's co-authors include A. Farcy, Didier Landru, B. Fléchet, P. Coudrain and J. Eymery and has published in prestigious journals such as Biomaterials, Physical Review B and Journal of The Electrochemical Society
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