F. Wulff
About
F. Wulff has authored 19 papers that have received a total of 295 indexed citations.
This includes 12 papers in Mechanical Engineering, 10 papers in Electrical and Electronic Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (6 papers) and Microstructure and mechanical properties (5 papers). F. Wulff is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (6 papers) and Microstructure and mechanical properties (5 papers) and collaborates with scholars based in Singapore and Germany. F. Wulff's co-authors include C.D. Breach, Subodh G. Mhaisalkar, C.C. Wong, Thirumany Sritharan and Thomas J. Ahrens and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds
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