Fa Xing

65 papers and 1.3k indexed citations i.

Fa Xing has authored 65 papers that have received a total of 1.3k indexed citations. This includes 58 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (54 papers), 3D IC and TSV technologies (39 papers) and Advanced Welding Techniques Analysis (12 papers). Fa Xing is often cited by papers focused on Electronic Packaging and Soldering Technologies (54 papers), 3D IC and TSV technologies (39 papers) and Advanced Welding Techniques Analysis (12 papers) and collaborates with scholars based in Singapore, Malaysia and United States. Fa Xing's co-authors include J.H.L. Pang, Xiaowu Zhang, Irfan Anjum Badruddin, Dhafer Abdulameer Shnawah and Mohd Faizul Mohd Sabri and has published in prestigious journals such as Materials Science and Engineering A, Computer Methods in Applied Mechanics and Engineering and Journal of Alloys and Compounds