Fei Chong Ng
About
Fei Chong Ng has authored 39 papers that have received a total of 282 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 13 papers in Computational Mechanics and 13 papers in Civil and Structural Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (11 papers) and Dam Engineering and Safety (8 papers). Fei Chong Ng is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (11 papers) and Dam Engineering and Safety (8 papers) and collaborates with scholars based in Malaysia. Fei Chong Ng's co-authors include Aizat Abas, M.Z. Abdullah, Daud Mohamad, Agusril Syamsir and Ismail Abustan and has published in prestigious journals such as The International Journal of Advanced Manufacturing Technology, International Journal of Cardiology and Microelectronics Reliability
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