Fei Qin
About
Fei Qin has authored 126 papers that have received a total of 1.7k indexed citations.
This includes 59 papers in Electrical and Electronic Engineering, 49 papers in Mechanical Engineering and 46 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (39 papers), Fatigue and fracture mechanics (16 papers) and 3D IC and TSV technologies (15 papers). Fei Qin is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), Fatigue and fracture mechanics (16 papers) and 3D IC and TSV technologies (15 papers) and collaborates with scholars based in China, United States and United Kingdom. Fei Qin's co-authors include Tong An, Pei Chen, Yanwei Dai, Yanpeng Gong and Yinghua Liu and has published in prestigious journals such as Chemistry of Materials, Analytical Biochemistry and Journal of Materials Chemistry
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