Fei‐Yi Hung
About
Fei‐Yi Hung has authored 194 papers that have received a total of 2.1k indexed citations.
This includes 105 papers in Electrical and Electronic Engineering, 93 papers in Materials Chemistry and 91 papers in Mechanical Engineering. The topics of these papers are Aluminum Alloys Composites Properties (53 papers), Electronic Packaging and Soldering Technologies (43 papers) and ZnO doping and properties (37 papers). Fei‐Yi Hung is often cited by papers focused on Aluminum Alloys Composites Properties (53 papers), Electronic Packaging and Soldering Technologies (43 papers) and ZnO doping and properties (37 papers) and collaborates with scholars based in Taiwan, United Kingdom and Australia. Fei‐Yi Hung's co-authors include Truan‐Sheng Lui, Shoou‐Jinn Chang, Lihui Chen, Lihui Chen and B. T. Dai and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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