Fengjiang Wang
About
Fengjiang Wang has authored 82 papers that have received a total of 1.3k indexed citations.
This includes 41 papers in Mechanical Engineering, 40 papers in Electrical and Electronic Engineering and 12 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (30 papers) and Intermetallics and Advanced Alloy Properties (16 papers). Fengjiang Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (30 papers) and Intermetallics and Advanced Alloy Properties (16 papers) and collaborates with scholars based in China, United States and Japan. Fengjiang Wang's co-authors include Lawrence M. Sayre, Michael C. Hewitt, Mingfang Wu and Luting Liu and has published in prestigious journals such as Journal of the American Chemical Society, Journal of Applied Physics and Biochemical and Biophysical Research Communications
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