Fengqun Lang
About
Fengqun Lang has authored 24 papers that have received a total of 448 indexed citations.
This includes 19 papers in Mechanical Engineering, 16 papers in Electrical and Electronic Engineering and 7 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (11 papers) and High-Temperature Coating Behaviors (7 papers). Fengqun Lang is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (11 papers) and High-Temperature Coating Behaviors (7 papers) and collaborates with scholars based in Japan, China and United States. Fengqun Lang's co-authors include Toshio Narita, Hiroshi Yamaguchi, Hiroshi Sato, Hiroshi Nakagawa and S.C. Deevi and has published in prestigious journals such as Journal of The Electrochemical Society, Japanese Journal of Applied Physics and Surface and Coatings Technology
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