Franz Schrank

49 papers and 599 indexed citations i.

Franz Schrank has authored 49 papers that have received a total of 599 indexed citations. This includes 34 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 8 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (9 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Franz Schrank is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (9 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers) and collaborates with scholars based in Austria, Germany and France. Franz Schrank's co-authors include Jochen Kraft, Anton Köck, E. Hengge, Stephan Steinhauer and J. Teva and has published in prestigious journals such as Journal of Applied Physics, Sensors and Actuators B Chemical and Thin Solid Films