Fuliang Wang
About
Fuliang Wang has authored 114 papers that have received a total of 1.0k indexed citations.
This includes 82 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 21 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (36 papers) and Electrodeposition and Electroless Coatings (32 papers). Fuliang Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (36 papers) and Electrodeposition and Electroless Coatings (32 papers) and collaborates with scholars based in China, Hong Kong and United States. Fuliang Wang's co-authors include Wenhui Zhu, Hu He, Hongbin Xiao and Junhui Li and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Scientific Reports.
In The Last Decade
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