Fumihiro Inoue
About
Fumihiro Inoue has authored 83 papers that have received a total of 435 indexed citations.
This includes 47 papers in Electrical and Electronic Engineering, 15 papers in Biomedical Engineering and 12 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (21 papers) and Electrodeposition and Electroless Coatings (16 papers). Fumihiro Inoue is often cited by papers focused on 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (21 papers) and Electrodeposition and Electroless Coatings (16 papers) and collaborates with scholars based in Japan, Belgium and The Netherlands. Fumihiro Inoue's co-authors include Shoso Shingubara, Eric Beyne, Alain Phommahaxay, Gerald Beyer and Harold Philipsen and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and Applied Surface Science
In The Last Decade
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